Memory corruption in QESL while processing payload from external ESL device to firmware.
References
| Link | Resource |
|---|---|
| https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin | Vendor Advisory |
Configurations
Configuration 1 (hide)
| AND |
|
History
12 Apr 2024, 17:17
| Type | Values Removed | Values Added |
|---|---|---|
| CWE | CWE-120 | |
| Summary |
|
Information
Published : 2023-08-08 10:15
Updated : 2024-04-12 17:17
NVD link : CVE-2023-28561
Mitre link : CVE-2023-28561
CVE.ORG link : CVE-2023-28561
JSON object : View
Products Affected
qualcomm
- qcn7606
- qcn7606_firmware
